? 1/7 product characteristics esd protection and emi filtering for: usb port description the EMIF02-USB01F2 is a highly integrated array designed to suppress emi / rfi noise for usb port filtering. the EMIF02-USB01F2 flip-chip packaging means the package size is equal to the die size. additionally, this filter includes an esd protection circuitry which prevents the protected device from destruction when subjected to esd surges up to 15 kv. benefits 2 lines low-pass-filter + 2 lines esd protection high efficiency in emi filtering lead free package very low pcb space consuming: < 2.5 mm 2 very thin package: 0.65 mm high efficiency in esd suppression (iec61000-4-2 level 4) high reliability offered by monolithic integration high reducing of parasitic elements through integration & wafer level packaging. complies with the following standards: iec61000-4-2 level 4 15kv (air discharge) 8kv (contact discharge) EMIF02-USB01F2 2 lines emi filter including esd protection rev. 1 october 2004 ipad? flip-chip (8 bumps) figure 1: pin configuration (ball side) 32 1 a pup vbus dz gnd d+ in d- in d+ out d- out b c d e table 1: order code part number marking EMIF02-USB01F2 ff tm: ipad is a trademark of stmicroelectronics. figure 2: configuration gnd vbus dz 1.3k d+ out d- out d- in d+ in pup 33 33
EMIF02-USB01F2 2/7 table 2: absolute ratings (t amb = 25c) table 3: electrical characteristics (t amb = 25c) symbol parameter and test conditions value unit t j junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage rd dynamic impedance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3v 0.5 a c line @ 0v 40 45 pf r 1, r 2 tolerance 5% 33 ? r 3 tolerance 5% 1.30 k ? slope: 1/rd
EMIF02-USB01F2 3/7 figure 3: s21 (db) attenuation measurement figure 4: analog crosstalk measurements figure 5: esd response to iec61000-4-2 (+15kv air discharge) on one input v(in) and on one output (vout) figure 6: esd response to iec61000-4-2 (-15kv air discharge) on one input v(in) and on one output (vout) figure 7: capacitance versus reverse applied voltage (typical) 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -50.00 -45.00 -40.00 -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 emif02-usb01: filtering response of lines c1/c3 and e1/e3 db frequency/hz 0.00 c1_c3 e1_e3 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -100.0 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 db f/hz 100ns/d vin : 10v/d vout : 10v/d 100ns/d vin : 5v/d vout : 5v/d 10 15 20 25 30 35 40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 vr(v) c(pf)
EMIF02-USB01F2 4/7 figure 8: aplac model (resistors, diodes and bumps and ground connections) figure 9: aplac model parameters 0.15nh bulk rsub_1k3 csub csub bulk r_33r cap_33r c3 rsub_33r cap_33r csub csub e1 0.23nh c1 a3 r_1k3 csub csub 3.8nh rsub_1k3 rsub_33r 0.3nh bulk r_33r cap_33r e3 rsub_33r cap_33r csub csub 0.7nh rsub_33r d2 bulk a1, a3, b2, c1, c3, e1, e3 0.15nh lgnd_d rsub_d d02_usb d02_nw d02_usb d2 lbump rbump lhole rhole caphole bulk cbump rsubump i/o bulk 100m d2 r_33r 33.9 cap_33r 1.2pf r_1k3 1.3k cz29pf rsub_d 100 csub0.3pf rsub_33r 15 rsub_1k3 50 lhole10ph rhole400m caphole0.4pf lgnd_d 150ph lbump50ph rbump50m cbump1.5pf rsubump150 r_33r 33.9 cap_33r 1.2pf r_1k3 1.3k model d02_usb bv=16 ibv=1m cjo=cz m=0.3333 rs=2 vj=0.6 tt=100n model d02_nw bv=100 ibv=1m cjo=6.8p m=0.3333 rs=2 vj=0.6 tt=100n
EMIF02-USB01F2 5/7 figure 10: ordering information scheme figure 11: flip-chip package mechanical data figure 12: foot print recommendations figure 13: marking emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip-chip x = 1: 500m, bump = 315m = 2: leadfree pitch = 500m, bump = 315m = 3: leadfree pitch = 400m, bump = 250m 495m 50 495m 50 1.27mm 50m 1.97mm 50m 315 50 700 50 650m 65 copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 315m copper pad diameter 365 240 220 e all dimensions in m dot, st logo xx = marking yww = datecode (y = year ww = week) z = packaging location 365 40 xxz y ww
EMIF02-USB01F2 6/7 figure 14: flip-chip tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 xxz yww st e xxz yww st e xxz yww st e 8 +/- 0.3 0.73 +/- 0.05 table 4: ordering information note: more informations are available in the application notes: an1235: ?flip-chip: package description and recommendations for use? an1751: "emi filters: recommendations and measurements" ordering code marking package weight base qty delivery mode EMIF02-USB01F2 ff flip-chip 3.35 mg 5000 tape & reel 7? table 5: revision history date revision description of changes 26-oct-2004 1 first issue
EMIF02-USB01F2 7/7 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2004 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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